Embedded LPC3250 Manuel d'utilisateur télécharger pdf (Page 2)

Embedded Artists AB

Södra Promenaden 51

SE-211 38 Malmö

Sweden

Phone/Fax: +46 (0)40-611 00 93

E-mail: [email protected]

http://www.embeddedartists.com

trademarks of their respective holders and should be treated as such.

Legal: http://www.embeddedartists.com/legal.php

Embedded Artists’

LPC3250 OEM Board v1.5 DS

The Art of Embedded Systems Development – made Easy™

Document status: Preliminary

Absolute Maximum Ratings

Stress above these limits may cause permanent damage to the board.

Technical Data

[1]

Extended temperature range can be supplied on request. Subject to minimum order volume.

[2]

Requires VDD

core

to be 1.35V.

[3]

Temperature range planned to be extended after passing Embedded Artists internal qualification process.

Mechanical Dimensions

Board width according to SO-DIMM standard: 67.6 mm. Board height (top and bottom) according to picture below:

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features ESD protection damages may

occur on devices subjected to high energy ESD. Therefore, proper ESD precaution should be

taken to avoid performance degradation or loss of functionality.

Parameter

Rating

VDD to GND (Supply voltage)

-0.2V to +4V

Digital/Analog Input/Output Voltage

-0.2V to VDD+0.2V

Storage temperature

-40°C to 100°C

Parameter

Min

Typical

Max

VCC Supply voltage

Ripple with frequency contents < 100kHz

Ripple with frequency contents ≥ 100kHz

3.10V

3.30V

3.50V

50mV

10mV

VCC

EXT

Supply voltage

1.40V

3.60V

Supply current

- idle, 32kHz RTC active

- low-power mode (13 MHz)

- executing from internal SRAM (266 MHz)

- executing from external SDRAM (266MHz)

- Ethernet+usb active

TBD

Max observed

VBAT current

TBD

Operating temperature

[1]

- 208 MHz core frequency

- 266 MHz core frequency

[2]

0°C

5°C

[3]

60°C

40°C

[3]

Relative Humidity (RH)

0°C < T

≤ 50°C, non-condensing

50°C < T

≤ 60°C, non-condensing

60°C < T

≤ 70°C, non-condensing

80%

50%

35%

Top side components

Bottom side components

50.0 mm

4.8 mm

1.2 mm

2.6 mm

1 2 3 4 5

LPC3250 OEM Board v1.5 DS 1

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Embedded LPC3250 Manuel d'utilisateur Page 2

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